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Transfer inovácií a diverzifikácia vysokoškolského vzdelávania do montážnych technológií v elektronike
Basic informations
TOP PROJECT
Thematic area: komisia č. 3 pre obsahovú integráciu a diverzifikáciu vysokoškolského štúdia
Project name (Slovak): Transfer inovácií a diverzifikácia vysokoškolského vzdelávania do montážnych technológií v elektronike
Start of project: 2008
End of project: 2010
Condition of project: Ukončený
Project number: 3/6465/08
Project leader: prof. Ing. Alena Pietriková, CSc.
University: Technická univerzita v Košiciach
Department: Fakulta elektrotechniky a informatiky
Anotácia originálnych výsledkov riešenia projektu v slovenskom jazyku
Cieľom projektu bolo zvýšiť kvalitu vzdelávania v študijných programoch zameraných na technológie v elektronike na Fakulte elektrotechniky a informatiky Technickej univerzity v Košiciach. Tento hlavný cieľ sa riešiteľom podarilo na vysokej úrovni naplniť adaptovaním existujúcej modulárnej koncepcie vyučovania, vytvorením vedecko-výskumného tímu pre vypracovanie modernej vysokoškolskej učebnice a vytvorením podmienok pre posilnenie flexibility a mobility študentov pri prechode medzi študijnými programami jednotlivých stupňov štúdia. Hlavným výstupom projektu je vysokoškolská učebnica, akreditované študijné programy 1. a 3. stupňa štúdia, vybudované laboratórium pre praktickú realizáciu montážnych a prepájacich technológií v elektronike a E-learningový program "Montážne technológie v elektronike". Publikované výstupy dosahujú vynikajúcu úroveň, čo potvrdili všetky posudky recenzentov. Nová koncepcia vzdelávania posilnila medzinárodnú konkurencieschopnosť Technickej univerzity v Košiciach v tejto oblasti vzdelávania a zvýšila potenciál pre internacionalizáciu výučby ako na strane poslucháčov, tak aj na strane pedagógov.
Description of original results of the project in English
The aim of this project has been to increase quality of education study programs intend on Technologies in electronics at Faculty of Electrical Engineering and Informatics Technical University of Kosice. This main aim has been filling on the high level by adapting of existing modular tuition concept, creating of scientific-research team for processing modern university course books and creating conditions for student's flexibility and mobility in changing study programs between particular study degrees. The main outputs from project are university course book, accredited study programs for the first and third level of study , constructed laboratory for practical realization of assembly and mounting technology in electronics. All expert opinions of opponents confirmed, that published results have excellent grade. New education concept intensified competitiveness of Technical University of Kosice in this area of education and student's and pedagogue mobility have contributed increase of education quality.
Financial grant of MŠVVandŠ SR within KEGA
| Financial grant of MŠVVandŠ SR within KEGA | Capital expenditures in € | |
|---|---|---|
| Drawn in year 2008 | 7 170,00 | 9 294,30 |
| Drawn in year 2009 | 7 100,00 | 0,00 |
| Drawn in year 2010 | 8 179,00 | 0,00 |
| Pumped for the entire period of the project | 22 449,00 | 9 294,30 |
List of project outcomes for the entire solution
Publishing activity
| Category code | Specific output, name (ISBN, number of pages a i.) |
|---|---|
| ADC | GABÁNI, S. , FLACHBART, K. , PAVLÍK, V. , PIETRIKOVÁ, A. GABÁNIOVÁ, M.: Microstructural analysis and transport properties of RuO2-based thick film resistors / In: Acta Physica Polonica A. - ISSN 1898-794X. - Vol. 113, no. 1 (2008), p. 625-628. |
| ADF | PIETRIKOVÁ, A - KARDOŠ, S. DEMKO, D. : Nízkofrekvenčné vlastnosti plošných cievok na báze rôznych hrubovrstvových technológií /In: Elektrorevue : Informačný spravodaj. ISSN 1336-8559. Roč. 10, mimoriadne č. (2008), s. 31-33. |
| AEC | PIETRIKOVÁ, A. - ĎURIŠIN, J. - LIVOVSKÝ, Ľ.- URBANČÍK, J.: Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints / In: ISSE 2008 : 31st International Spring Seminar on Electronics Technology. - P. 365-368. - Budapest : Budapest University of Technology and Economics, Department of Electronics Technology, 2008. - http://www.isse-eu.net - ISBN 978-963-06-4915-5. |
| AEC | LIVOVSKÝ, Ľ., PIETRIKOVÁ, A. - ĎURIŠIN, J.: Monitoring of the temperature profile of vapour phase reflow soldering / In: ISSE 2008 : 31st International Spring Seminar on Electronics Technology. - P. 687-689. - Budapest: Budapest University of Technology and Economics, Department of Electronics Technology, 2008. - http://www.isse-eu.net - ISBN 978-963-06-4915-5. |
| AEC | MACH, P. - RICHTER, L. - PIETRIKOVÁ, A.: Modification of electrically conductive adhesives for better mechanical and electrical properties. In: ISSE 2008 : 31th International Spring Seminar on Electronics Technology. - P. 230-235. - Budapest : Budapest University of Technology and Economics, Department of Electronics Technology, 2008. - http://www.isse-eu.net - ISBN 978-963-06-4915-5. |
| AEC | PIETRIKOVÁ, A. - ĎURIŠIN, J.: Microstructure of vapour phase reflowed SAC solder alloy In: Materiál v inžinierskej praxi 2008 : Zborník 7. medzinárodnej vedecko-technickej konferencie. - S. 23-26. - Košice : TU, 2008. - ISBN 978-80-8073-945-4. |
| AEC | PIETRIKOVÁ, A. - ĎURIŠIN, J., URBANČÍK, J. Reliability of Pb-free Solder Joint Under Different Test Conditions, International Symposium for Design and Technology of Electronic Packages, SIITME, 14th Edition, Brasov, Romania, ISSN 1843-5122, pp. 85 - 88 |
| AEC | ZSOLT ILLYEFALVI-VITÉZ, SVASTA, P., CODREANU, N., PIETRIKOVA, A.: E-Learning Training System for Electronics Assembling Technology, International Symposium for Design and Technology of Electronic Packages, SIITME, 14th Edition, Brasov, Romania, ISSN 1843-5122, pp. 356 - 361 |
| AEC | URBANČÍK, J., PIETRIKOVÁ, A: Reliability Aspect of Polymer Thick Film Interconnections in Hybrid Circuits, International Symposium for Design and Technology of Electronic Packages, SIITME, 14th Edition, Brasov, Romania, ISSN 1843-5122,pp.111 – 114 |
| AEC | MACH, P., RICHTER, L., PIETRIKOVÁ, A.: Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesive, 2nd Electronics Systemintegration Technology Conference, 2008, Greenwich, UK, IEEE Catalog Number: CFP08TEM-PRT, ISBN: 978-1-4244-2813-7, Library of Congress: 2008906795, pp. 305 – 309 |
| AEC | MACH, P., RADEV, R., PIETRIKOVA, A.: Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles, 2nd Electronics Systemintegration Technology Conference, 2008, Greenwich, UK, IEEE Catalog Number: CFP08TEM-PRT, ISBN: 978-1-4244-2813-7, Library of Congress: 2008906795, pp. 1141-1146 |
| AEC | PIETRIKOVÁ, A. - ĎURIŠIN, J.: Microstructure evolution of Vapour Phase Reflowed tinsilver Copper Alloy, International Conference on Applied Electrical Engineering and Informatics 2008, AEI 2008, Greece, Athens ISBN: 978-80-553-0066-5 © 2008, pp. 83-86 |
| AEC | URBANČÍK, J., PIETRIKOVÁ, A: Technological Approach to Design and Reliability of Interconnections in LTCC Multilayer Modules, International Conference on Applied Electrical Engineering and Informatics 2008, AEI 2008, Greece, Athens ISBN: 978-80-553-0066-5 © 2008, pp. 149-152 |
| AEC | URBANČÍK, J., PIETRIKOVÁ, A:Influence of Production Technology to Reliability of Interconnetions in the LTCC Modules, In: ISSE 2008 : 31st International Spring Seminar on Electronics Technology. - P. 687-689. - Budapest: Budapest University of Technology and Economics, Department of Electronics Technology, 2008. - http://www.isse-eu.net - ISBN 978-963-06-4915-5 |
| ADE | PIETRIKOVÁ, A. – LIVOVSKÝ, Ľ. – DURIŠIN, J.: Sledovanie štruktúr spojov na báze zliatiny SAC. Electroscope, ročník 2009, číslo 2_2009. ISSN 1802-4564 |
| ADE | LIVOVSKÝ, Ľ. – PIETRIKOVÁ, A.: Meranie teplotného profilu v prostredí nasýtených pár, Electroscope, ročník 2009, číslo 2_2009. ISSN 1802-4564 |
| ADE | CABÚK, P. – VEHEC, I. – SLOSARČÍK, S.: Measuring of pressure in intra-abdomen. In: Recent Advances in Numerical Modeling, Warsaw – Lublin 2009, Poland, Electrotechnical Institute Publishing House, IEEE 2009. p. 162-166. ISBN 978-83-922095-8-4. |
| ADF | KARDOŠ, S. – SOMORA, M. – SLOSARČÍK, S. – URBANČÍK, J. – VEHEC, I.: Anisotropic conductive joints utilization for joining of flexible cables at rigid substrates. In: Journal of Electrical Engineering. Vol. 60, No. 1 (2009), p. 48-52. ISSN 1335-3632. |
| AEC | URBANČÍK, J. – PIETRIKOVÁ, A.: Vocational training and further education in electronic technology as feasible TQM tool : 32nd International Spring Seminar on Electronics Technology, ISSE 2009: Hetero System Integration, the path to New Solutions in the Modern Electronics. S.l. : IEEE, 2009. 1 elektronický optický disk (CD-ROM). p. 1-5. ISBN 978-1-4244-4260-7. |
| AEC | PIETRIKOVÁ, A. – ĎURIŠIN, J. – URBANČÍK, J. – BANSKÝ, J.: Analysis of intermetallic compounds in lead-free solders. In: 32nd International Spring Seminar on Electronics Technology, ISSE 2009 : Hetero System Integration, the path to New Solutions in the Modern Electronics. May 13th - 17th, Brno, Czech Republic. Brno : University of Technology, IEEE 2009. - 1 elektronický optický disk (CD-ROM). p. 1-5. ISBN 978-1-4244-4260-7. |
| AEC | VEHEC, I. – CABÚK, P. – SLOSARČÍK, S. – DOVICA, M.: Technological possibilities of LTCC ceramic for field of sensors. In: 32nd International Spring Seminar on Electronics Technology, ISSE 2009 : Hetero System Integration, the path to New Solutions in the Modern Electronics : May 13th - 17th, Brno, Czech Republic. Brno : University of Technology, IEEE 2009. p. 1-6. ISBN 978-1-4244-4260-7. |
| AEC | KARDOŠ, S. – PIETRIKOVÁ, A. – KUSKO, M.: Uzavretá manipulačná komora pre technologické laboratórium. In: Elektrotechnologie 2009, Temešvár, 7.-9. září 2009 : Sborník konference. - Praha : ČVUT, 2009. 1 elektronický optický disk (CD-ROM). p. 1-6. ISBN 978-80-01-04379-0. |
| AEC | PIETRIKOVÁ, A. – KARDOŠ, S. – CABÚK, P. – VEHEC, I.: Koncepcia celoživotného vzdelávania v oblasti technológií v elektronike na KTE. In: Elektrotechnologie 2009, Temešvár, 7.-9. září 2009 : Sborník konference. Praha : ČVUT, 2009. - 1 elektronický optický disk (CD-ROM). p. 1-3. ISBN 978-80-01-04379-0. |
| AEC | VEHEC, I. – SLOSARČÍK, S. – PIETRIKOVÁ, A. – CABÚK, P. – KRAVČÍK, M.: Porovnanie vybraných metód vytvárania dutín v LTCC keramikách. In: Elektrotechnologie 2009 , Temešvár, 7.-9. září 2009 : Sborník konference. Praha : ČVUT, 2009. - 1 elektronický optický disk (CD-ROM). p. 1-5. ISBN 978-80-01-04379-0. |
| AEC | LIVOVSKÝ, Ľ. – PIETRIKOVÁ, A.: Meranie teplotného profilu v prostredí nasýtených pár : mezinárodní vědecká konference: Diagnostika '09, sborník. - Plzeň : Západočeská univerzita v Plzni, 2009. p. 40-43. ISBN 978-80-7043-793-3. |
| AEC | BANSKÝ, J. – PIETRIKOVÁ, A. – VEHEC, I.: Transfer innovation into vocational training and further education in electronics technology. In: IMAPS - CPMT IEEE Poland , 33 International Conference : Proceedings : Pszczyna 21 - 24 September 2009, Pszczyna, Poland. Gliwice : Silesian University of Technology, 2009. 1 elektronický optický disk (CD-ROM). p. 281-284. ISBN 978-83-917701-7-7. |
| AEC | PIETRIKOVÁ, A . – BANSKÝ, J. – LIVOVSKÝ, Ľ. – VEHEC, I.: Thermal profiling in VPS : 33 International Conference: IMAPS - CPMT IEEE Poland , 33 International Conference : Proceedings : Pszczyna 21 - 24 September 2009, Pszczyna, Poland. Gliwice : Silesian University of Technology, 2009. 1 elektronický optický disk (CD-ROM). p. 52-55. ISBN 978-83-917701-7-7. |
| AEC | PIETRIKOVÁ, A. – LIVOVSKÝ, Ľ. – ĎURIŠIN, J.: Sledovanie štruktúr spojov na báze zliatiny SAC. Sborník mezinárodní konference : Diagnostika '09, Srní 9.-11. září 2009. Plzeň : Západočeská univerzita, 2009. p. 187-190. ISBN 978-80-7043-793-3. |
| AEC | PIETRIKOVÁ, A. – ĎURIŠIN, J.: VPS and reliability of solder joint. 15th International Symposium for Design and Technology of Electronics Packages : SIITME 2009, Gula, 17-20 Sep 2009. Piscataway : Institute of Electrical and Electronics Engineers, 2009. 1 elektronický optický disk (CD-ROM). p. 445-448. |
| AEC | PIETRIKOVÁ, A. – BRANZEI, M. – MICULESCU, F. – CONSTANTINESCU, D. – BALAN, C. – CUCU, T. – VARZARU, G.: HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment : 15th International Symposium for Design and Technology of Electronics Packages : SIITME 2009, ula, 17-20 Sep 2009. - Piscataway : Institute of Electrical and Electronics Engineers, 2009. 1 elektronický optický disk (CD-ROM). p. 99-104. |
| AEC | KOŽÁR, S. – CULKOVÁ, E. – PIETRIKOVÁ, A.: Project "Elec2eat" - key to succesful train the trainers in Slovakia: 15th International Symposium for Design and Technology of Electronics Packages : SIITME 2009, Abtract Proceedings. - Budapest : Budapest University of Technology and Economics, 2009. p. 32-33. |
| AED | PIETRIKOVÁ, A – ĎURIŠIN, J.: Microstructure and reliability of solder joints. Proceedings of the scientific conference: Physics of Materials '09, 14-16 October 2009, Košice, Slovakia. Košice : Elfa, 2009. - 1 elektronický optický disk (CD-ROM). p. 38-41. ISBN 978-80-8086-122-3. |
| AED | ĎURIŠIN, J.: Microstructure development of SnAgCu solder joint. SCYR 2009 : 9th Scientific Conference of Young Researchers : proceedings from conference. Košice : FEI TU, 2009. 1 elektronický optický disk (CD-ROM). p. 38-40. ISBN 978-80-553-0178-5. |
| AFC | PLOTOG, I. – SVASTA, P. – VILLAIN, J. - ILLYEFALVI-VITEZ, Z. – PIETRIKOVÁ, A. –BALAN, C. – CUCU, T. – VARZARU, G.: HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment : 15th International Symposium for Design and Technology of Electronics Packages : IEEE document, SIITME 2009, ula, 17-20 Sep 2009. - Piscataway : Institute of Electrical and Electronics Engineers, 2009. 1 elektronický optický disk (CD-ROM). p. 99-104. |
| AFC | KOŽÁR, S. – CULKOVÁ, E. – PIETRIKOVÁ, A.: Project "Elec2eat" - key to succesful train the trainers in Slovakia: 15th International Symposium for Design and Technology of Electronics Packages : CPMT IEEE , SIITME 2009, Abtract Proceedings. - Budapest : Budapest University of Technology and Economics, 2009. p. 32-33. |
| AAB | Pietriková, A., Ďurišin, D., Mach, P.: Diagnostika a optimalizácia použitia ekologických materiálov pre vodivé spájanie v elektronike, 1. vydanie, Vydavateľ: Fakulta elektrotechniky a informatiky Technickej univerzity v Košiciach , Košice, 2010, 301 strán, 14 AH, ISBN 978-80-553-0447-2 |
| ADF | PIETRIKOVÁ, A. — ĎURIŠIN, J.: Microstructure of Solder Joints and Isothermal Aging, Acta Electrotechnica et Informatica, Vol. 10, No. 3, 2010, 43–46, ISSN 1335-8243 © 2010 FEI TUKE |
| AFC | Pietriková, Alena, Ďurišin, Juraj : Principle of X-ray investigation of solder alloy, ISSE 2010 : 33rd International Spring Seminar on Electronics Technology : Polymer Electronics and Nanotechnologies: towards System Integration : 12 - 16 May 2010, Warsaw, Poland : University of Technology, 2010. - ISBN 978-83-7207-874-2. - P. 43-44 |
| AFC | Kardoš, Slavomír, Pietriková, Alena, Ďurišin, Juraj, Kusko, M. : Clean manipulation chamber for technologic laboratory In: ISSE 2010 : 33rd International Spring Seminar on Electronics Technology : Polymer Electronics and Nanotechnologies: towards System Integration: 12 - 16 May 2010, Warsaw, Poland : University of Technology, 2010. - ISBN 978-83-7207-874-2. - P. 269-270. |
| AFC | Bunea, R., Plotog, I., Svasta, P., Pietriková, Alena, Ďurišin, Juraj: Infrared analysis of temperature distribution on the surface of a populated PCB, n: ISSE 2010 : 33rd International Spring Seminar on Electronics Technology : Polymer Electronics and Nanotechnologies: towards System Integration : 12 - 16 May 2010, Warsaw, Poland : University of Technology, 2010. - ISBN 978-83-7207-874-2. - P. 116-117. |
| ADF | Alena Pietriková, Juraj Ďurišin, Praktické aspekty bezolovnatého spájkovania, In: Časopis pre elektrotechniku a energetiku. - ISSN 1335-2547. - Roč. 16, č. 2 (2010), s. 36-39. |
| ADF | PIETRIKOVÁ, J. ĎURIŠIN, I, Vehec.: Vývoj unikátnej technológie pre prepojovacie techniky štruktúr výkonovej elektroniky, In.: TRANSFER č. 2, roč. II, jún/2010, ISSN 13337-9747, p. 16-19 |
| ADF | Ľubomír Livovský, Alena Pietriková, Juraj Banský: Meranie teplotného profilu a chyby vznikajúce pri pretavení spájkovacej pasty, In: Elektrotechnika v praxi. ISSN 0862-9730. Vol. 20, no. 3-4 (2010), p. 136-139. Spôsob prístupu: http://www.bael.cz/ |
| ADF | A. Pietriková, J. Ďurišin, Mikroštruktúra spájkovaného spoja na báze SnAgCu spájky, In: Časopis pre elektrotechniku a energetiku. ISSN 1335-2547. Roč. 16, č. 3 (2010), s. 36-37. |
| ADF | Slavomír Kardoš, Alena Pietriková, Martin Kusko: Manipulačná komora pre technologické procesy, In: Elektrotechnika v praxi. - ISSN 0862-9730. Vol. 20, no. 5-6 (2010), p. 42-44., Spôsob prístupu: http://www.bael.cz/ |
Other outcomes (eg e-learning, websites, virtual laboratory, training, courses, workshops and the like.)
| Output name | Description of output | Link |
|---|---|---|
| E-learning | 2-jazyčná Virtuálna továreň zameraná na Montážne technológie v elektronike | http://www.elect2eat.eu/elect2eat.eu/Sk/index.html |
Final evaluation of the commission KEGA
Splnil ciele excelentne (s dosiahnutím celospoločenských prínosov).